Prof. Sunny Li

Mechanical Engineering, The University of British Columbia (UBC), Canada

E-mail: sunny.li@ubc.ca

Bio

Dr. Sunny Li is a professor of mechanical engineering at The University of British Columbia (UBC), Okanagan campus. He is the director of UBC Thermal Management and Multiphase Flows Lab, the former Chair of CSME Thermal Science and Engineering Committee, and the Canadian Delegate on The Assembly for International Heat Transfer Conferences. His research centers around the fluid dynamics of multiphase flows and heat transfer involved in high-heat-flux cooling technologies and applications, with focus on the cooling and thermal management for microelectronics and power electronics. Before joining UBC, he was a research scientist in the Electronics Cooling Lab at the Global Research Center of General Electric, Schenectady, New York. He received his MASc and Ph.D. in mechanical engineering from University of Toronto in 2004 and 2008, respectively.

Title

Direct Forced-flow Liquid Cooling on Microchips

Abstract

Playing a critical role in global technology innovation and economic growth, microchips are becoming more powerful and compact. Effective, feasible, and reliable cooling solutions are needed for addressing the challenges of transferring more heat through smaller areas while still maintaining the chip temperature within its safety range. Besides, innovative and effective cooling solutions are needed for Moore's law to continue. The cooling solution to be discussed in this talk has a flow of liquid coolant directly onto the semiconductor surface. Flowing through a nozzle plate with a number of orifices, the flow enters a confined space between the nozzle plate and the chip surface. The number, size, and distribution of the orifices and flow exits are studied to understand their relations with the cooling performance, which can be used for optimizing the thermal design.  Applying this cooling method will significantly change the traditional microchip packaging as this cooling solution is integrated into microchip packaging.